TAEC Announces New TB7001FL Multi-Chip Module

Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) and its parent company Toshiba Corp. (Toshiba) announced its new TB7001FL multi-chip module (MCM), which combines a driver IC with a MOSFET and the company's MOSBD (a single-die combination of a power MOSFET and a Schottky barrier diode), in one package measuring 8 mm x 8 mm x 0.85 mm. The new MCM represents a level of integration beyond the company's dual-channel MOSBD product, which combines a high-side MOSFET with a low-side MOSFET/Schottky barrier diode.

The new MCM, which employs its power MOSFET for the high side of the dc-dc converter, the MOSBD to handle low-side functions, and the driver IC, which includes a high-speed MOS gate driver and level shifter functions to drive the high-side MOSFET, can deliver up to 20 A at 1.5 V (maximum operating voltage to the power stage is 19 V). Designed to work at switching frequencies to 1 MHz, it boasts an efficiency of greater than 84 percent (12 V input).

Built-in functions include a low-side MOSBD shutdown input, thermal shutdown, and under-voltage protection. The TB7001FL is lead-free and is RoHS-compatible. Customer samples of the TB7001FL are available now, and prices start at $4.50 each for sample quantities.