ON Semi Debuts PInPak Packaging Technology
ON Semiconductor LLC (Phoenix, AZ) introduced its new power integrated packaging (PInPAK™) proprietary packaging technology that is the platform for the NIS3001, a power management device for dc/dc converters that integrates a "packaged" analog driver and multiple MOSFETs into a single 10.5mm x 10.5mm leadless package. The device delivers up to 20A at 1MHz, improving power system efficiency and reducing utilized board space by 50 percent on motherboards for computing and telecom platforms.
The NIS3001 utilizes ON’s PInPAK™ technology, which involves the assembly of an analog-driver die housed in a standard QFN package. The analog QFN is then co-packaged in a main-power QFN lead frame along with two MOSFET die. The entire module is then mold-array-process, over-molded. The high-side NTC60N02R and low-side NTC95N02 MOSFETs incorporate ON’s patented HD3E planar technology. The NIS3001 includes a low RDS(on) device (2.6 milliohms) for the synchronous MOSFET and a fast device for the control MOSFET.
The NIS3001 is currently sampling and is scheduled for production release early in 2003. Limited sampling of the NIS3001 is currently underway. Pricing is $3.10 per unit in 10,000-unit quantities.