NuSil Presents New Thermally Conductive Electronic Packaging Material
NuSil Technology LLC, a global specialist in silicone materials for the electronics and photonics industries, announced its EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk.
Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. A low volatility elastomer, EPM1-2493 can reduce or even prevent contamination of electronic device components used in applications exposed to high heat, such as solder reflow at 260°C. EPM1-2493 adheres well to aluminum, and its adhesive strength can be improved with the use of a primer, achieving average lap shear values of120 psi (0.8 MPa).
EPM1-2493 does not have the typical paste-like consistency of other thermally conductive silicones. Rather, it is a pourable, conformal liquid that is excellent for potting/filling recessed areas and applying to intricate geometries in electronic applications. It can also be used for adhering integrated circuit substrates, base plates or heat sinks, or where grooves or other configurations require a limited flow material.
"The conformal quality of EPM1-2493 enables it to work well with complex geometries and where thin bond lines are required for lower thermal resistance," said Senior Technologist Michelle Velderrain. "It can be used as an adhesive or coating in virtually any application requiring a thermally conductive, electrically insulative, self-leveling material."
For further ease of use, EPM1-2493 is supplied in a convenient 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. This elastomer cures at lower temperature but can be heat-accelerated for faster cure time.
