IXYS Intros DAB Power Semiconductor Technology

IXYS Corp. (Santa Clara, CA), a supplier of power semiconductors and ICs for power conversion, motor control, medical electronics and telecommunication applications, announced its new direct-aluminum-bonded (DAB) substrate technology. The DAB technology is claimed to be more advanced than the direct-copper-bonded (DCB) technology, which has been used for the production of integrated power semiconductor modules, including motor drives, dc/dc converters and power supply bricks.

The direct-metal-bonded (DMB) technology offers highly reliable substrates with electrical isolation and high thermal conductivity onto which power semiconductor chips are soldered to create the high power modules. Prior-generation DMBs were basically DCBs where copper has been the main conductor that is bonded to alumina or aluminum nitride ceramics. In the DAB technology, aluminum is the conductor, and it forms a rugged and reliable bond to the ceramic, resulting in good thermal cycling performance as demanded by critical power control applications in the automotive, aerospace and industrial applications.

Deliveries of sample quantities are from stock with production quantities available in 8 to 16 weeks.