Integrated Power Modules with 7th Generation IGBTs

Mitsubishi Electric Corporation announced today that it will begin shipping samples of its new G1 series intelligent power module (IPM) featuring seventh-generation IGBTs, comprising three different packages and 52 models in total. The new modules deliver reduced power loss and improved reliability for general-purpose inverters, servo amplifier, elevators and other industrial equipment. Sample shipments will begin in May.

Full technical specifications of the modules will be announced at major trade shows including MOTORTECH JAPAN 2016 during TECHNO-FRONTIER 2016 in Japan from April 20 to 22. Product features include: Reduced power loss thanks to upgraded IGBT and diode Seventh-generation CSTBTTM chip achieves lower power loss and EMI noise. And relaxed Field of Cathode (RFC) diode chip incorporating new backside diffusion process achieves low power loss and suppression of recovery-voltage surge.

New package technology downsizes industrial equipment and improves its reliability New compact packaging achieved by optimizing the main terminal shape realizes approximately 30 percent reduction in package size compared to the previous product, thereby contributing to the provision of compact, lightweight inverters. And integration of insulation and copper base in the substrate helps to increase thermal cycle life, leading to more reliable equipment performance.

Two new functions eases design in customers' development processes Easily spot the cause of errors through adoption of a new error mode identification process. And improved trade-off between energy losses and noise by adopting new automatic two phase switching speed change function.