New Industry Products

Mitsubishi Electric’s IGBT Module for High Power Industrial and Renewable Applications

November 17, 2020 by Hailey Stewart

This article highlights Mitsubishi Electric Corporation LV100 T-series IGBT modules for industrial application that will be available for 1200V and 1700V blocking voltages and enable the reduction of size and power loss of power converters.

Mitsubishi Electric Corporation has launched the LV100-type T-series IGBT (Insulated-Gate Bipolar Transistor) module for industrial use in September 2020. The common outline LV100 package, which achieves high versatility and high current density, is widely used and established in railway and electric power applications and now has been adapted for industrial and renewable use.

 

Image courtesy of Mitsubishi Electric Corporation
Image courtesy of Mitsubishi Electric Corporation

 


 

The new LV100 T-series IGBT modules for industrial application will be available for 1200V and 1700V blocking voltages and enable the reduction of size and power loss of power converters, especially in the field of renewable energy applications such as photovoltaic and wind-power generation, and also high-power motor drives. The modules are equipped with the latest 7th-generation IGBT, based on Mitsubishi’s CSTBT™ (Carrier Store Trench Bipolar Transistor) structure, and the latest RFC (Relax Field of Cathode) diode for achieving low power losses. The RFC diode has an optimized electron mobility at the cathode side. These low power losses in combination with the optimized package structure result in an industry-leading current density of 17.14A/cm². Therefore the module is enabling the miniaturization of power converters and inverterized high power motor drives.

The internal module structure has been optimized for more reliable inverter systems. Both insulation and copper parts have been integrated into a novel baseplate structure thus enabling an optimization of the internal electrode structure and extending the thermal cycling life to highest industry’s class. Thermal cycling life is the lifespan due to stress-strain caused by gradual temperature changes which is generated for example by system start and stop load cycles. By this new structure a low package inductance has been realized. As result the optimized internal structure will contribute to the equipment reliability. The terminal layout of the LV100 package is optimized for easy paralleling and flexible inverter configurations and power ratings. The three AC main terminals help to reduce and equalize the terminal current density for achieving an increased inverter power rating.