New Industry Products

HP Announces Second-Generation Modular Cooling System G2

May 11, 2008 by Jeff Shepard

Hewlett Packard (HP) unveiled technology which it claims makes data centers more efficient while increasing system reliability – the new Modular Cooling System (MCS) G2, a bi-directional cooling rack.

HP MCS G2 adds to data center computing power and existing cooling infrastructure without adding to the overall heat load. This second generation liquid cooling rack uses what is described as an innovative bi-directional cooling technology designed for data centers with dense computing infrastructure and limited space. Building upon the technology included in the first generation MCS, the MCS G2 can simultaneously cool two server racks or concentrate up to 35kW to cool a single rack. The MCS G2 is said to significantly reduce the cost to cool a standard rack of IT gear, as well as decreases the amount it costs to cool the maximum amount of ultra dense servers and blades.

Other MCS G2 features include: integration with HP Systems Insight Manager; a decreased 15.8 gallons per minute (GPM) for max cooling, resulting in lower operational costs; an expansion rack CTO capable of supporting up to 2000 lbs. of servers, storage and blades; adjustable temperature set point; polycarbonate front door to considerably reduce ambient noise; automatic door release mechanism; configurable with servers and storage via HP’s Factory Express service.

The HP Modular Cooling System (MCS) G2 is priced starting at $24,499. Various product options are available.