Ericsson Power Modules (Sweden) announced its new pin-compatible, eighth-brick, dc/dc power modules, the PKB Series, which cut costs by 30 percent and board space by 50 percent. Designed for on-board distributed power architectures in wireless base stations, inter-networking and other telecom applications, the PKB Series modules provide up to 20A at 3.3Vdc, and feature high efficiency, fast dynamic response and low output ripple.
The new modules offer a small footprint of 0.75in x 2.28in x 0.3in (19mm x 57.9mm x 7.6mm) and use non-baseplated construction to facilitate close board spacing. The PKB modules are 89 to 90 percent at 3.3V and full load, minimizing heat generation and maximizing system reliability. Using two single-output, eighth-brick devices to replace a dual-output, quarter-brick product provides complete output isolation and greater design flexibility, while compliance with the eighth-brick standard pin-out gives customers the security of multiple sourcing. The Ericsson devices have a mean time between failures of over 2 million hours at 85 degrees C.
The typical output ripple is from 60mV peak-to-peak (3.3V) to 150mV peak-to-peak (1.8V). The dynamic response for the 12V module is typically 150µS/150mV peak, and for other modules it is 100µV/100mV peak. The PKB Series modules have 2,500Vdc isolation and operate with a maximum printed circuit board temperature of 120 degrees C.
The PKB Series comprises 1.8V/25A, 3.3V/20A, 5V/12A and 12V/5.3A devices, all of which are available for sampling now. Additional 2.5V/22A, 1.5V/25A and 1.2V/28A versions are due to be introduced in the first quarter of 2003. All have through-hole pinning for effective transfer of heat to the printed circuit board. All of the PKB Series will also be offered in surface-mount packages in early 2003.
