Ericsson Introduces High Power Density Converter for Data-Network Equipment
Ericsson Power Modules has introduced a new ultra-high-power-density dc-dc converter which the company says can make a significant contribution to energy saving in data centers. According to Ericsson, the exceptional ability of this new small-footprint converter to handle high power and deliver tightly controlled output-voltages makes it well suited for use in networking and data storage equipment.
Available in an industry-standard quarter-brick footprint, the new module, BMR453-0108/014, provides an output voltage of 12.45V with an output current of 60A, delivering a total output power of 711W. The BMR453-0108/014 combines two Ericsson BMR453 series power modules, assembled in parallel and offers a power density as high as 33.38W/cm2 (215W/in2) while it embeds digital core controllers. Due to its built-in energy optimization capabilities, the BMR453-0108/014 delivers 96.9% efficiency at half load and up to 95.8% at full load.
"Not only are there are very few products available on the market that can to deliver this level of power handling in a quarter-brick format, the new Ericsson BMR453-0108/014 is also the first high-power-density solution based on digitally controlled dc-dc converters," said Patrick Le Fèvre, Marketing and Communication Director of Ericsson Power Modules.
Specially designed for data communications applications requiring high power and a regulated intermediate bus converter within a limited footprint, a key benefit of the BMR453-0108/014 is that it offers a 44 to 75V input voltage range and is compatible with 48, 52 and 60V systems.
Based on the BMR453 platform, the BMR453-0108/014 is well suited for powering networking applications such as network processing encryption, load balancing and managing data-center traffic, in addition to powering arrays of disk drives, which require a stable voltage to guarantee data integrity. The new product is also well suited for use in production and test systems, such as those used in the semiconductor industry.
Measuring 57.9 x 36.8 x 24.5 mm (2.28 x 1.45 x 0.965 in), the device’s footprint is fully compatible with ’five-pin’ quarter-brick intermediate bus converters, also simplifying migration from static intermediate bus architectures to more advanced topologies such as Dynamic Bus Voltage.
Offering an MTBF (Mean-Time-Before-Failure) of 1.2 million hours, the BMR453-0108/014 meets safety requirements according to IEC/EN/UL 60950-1, and offers input/output isolation of 1500Vdc and protection features including over-temperature, over current, and over- and under-voltage.
The BMR453-0108/014 is available either with a baseplate for easy assembling to cold-wall cooling or with a built-on heatsink for use in forced-air-cooling applications.