Diodes Inc. announced its first transistor products in its miniature PowerDI®5 surface mount package. Designed on the company’s 5th generation matrix emitter process, a range of 12 NPN and PNP transistors has initially been released, helping designers to significantly raise power densities and shrink solution size. With a footprint of just 26mm², PowerDI®5 occupies 47% less space than SOT223 and 60% less space than DPAK. In terms of off-board height, PowerDI®5’s 1.1mm compares favorably with SOT223’s 1.65mm and DPAK’s 2.3mm.
PowerDI®5’s minimum copper power rating of 0.74W means that it delivers excellent thermal performance from a small area to dramatically improve power density. Its thermal resistance rating of 75°C/W on 25 x 25mm copper and FR4 gives a power rating of 1.7W, enabling it to replace SOT223 in applications that rely on package thermal performance.
The first NPN and PNP bipolar products in the new PowerDI®5 package are aimed at datacom, telecom, motor drive and battery charger applications.
In 100, 140 and 200V ratings, with low saturation voltage and fast switching characteristics, the DXT2013P5, DXT2014P5 and DXTP03200BP5 achieve good efficiency improvements in SLIC dc-dc converters. In linear battery chargers, the low saturation voltage of the 20V DXTP19020DP5 ensures battery charging to full capacity even at a low charger input voltage.
The package’s small size and low thermal resistance makes the 100V rated DXTN07100BP5 device well suited for 48V regulator applications, and the DXT5551P5 as a telecom line driver when higher voltages are needed to accommodate long line length.
