CTS Introduces New Integrated ZIF Heat Frame

CTS Corp. announced the introduction of its new line of Integrated ZIF Heat Frames (iZIF™).

CTS Electronic Components now offers an improved packaging and thermal solution for single board computers that support rugged commercial and military applications. Single board computers exposed to high shock/vibration environments require a heat frame for stability. Currently, board retainers are mounted onto a heat frame with some combination of screws, rivets and thermal greases in attempts to minimize the thermal barrier created at the individual surfaces.

The company claims that the iZIF™ is the first ever fully integrated board retainer. This patent-pending design provides improved structural integrity and superior thermal dissipation over screw-mounted board retainers. With the board retainer integrated into the heat frame, a thermal barrier is eliminated. No barrier means maximum thermal management efficiency.