AIT Offers New Stacked-Die QFN-MCM Package

Advanced Interconnect Technologies (AIT, Singapore) introduced a new stacked-die, quad-flat, no-lead, multi-chip module (QFN-MCM) package that will offer space-saving and cost-saving advantages to designers of portable consumer-electronics products such as camcorders and cell phones. The new package is 0.9 mm tall and has a minimal die thickness of 7 mils. It is "green-compliant" and has a moisture sensitivity level of 260 C.

"We are using standard assembly processes , rather than employing super-thin wafers or ultra-thin mod cap like our competitors," said Jean Ramos, AIT's director of package-development engineering. "These processes assure good yields, and work off of processes that are already being deployed in the industry."

The new QFN-MCM packaging is priced from $0.08 to $0.14 per I/O, depending on package configuration and volume.