New Industry Products

650V/60A Bottom-Side-Cooled GaN FET for Space, Military and COTS Designs

September 19, 2018 by Paul Shepard

Teledyne e2v HiRel Electronics, a business unit of the Teledyne Defense Electronics Group, today introduced a new 650V GaN FET device that is dedicated to demanding HiRel applications. This 650V FET is the highest voltage GaN FET device currently in use in the market.

The TDG650E60 is a 650V/60A enhancement mode power transistor. It is built in a GaN-on-silicon process and packaged in GaN System’s GaNPX™ Package. This package enables very low inductance and thermal resistance in a small 11x9mm outline. The package is bottom-side cooled to offer very low junction-to-case thermal resistance. GaN System’s patented “Island” technology is key to enabling high voltage, current, and efficiency.

This new Teledyne e2v HiRel plastic GaN FET is the first 650V part released from the new Teledyne e2v HiRel Enhanced Product (EP) series that addresses the concerns of customers in applications where ceramic packages are not required. In such applications, the cost and earliest availability of newer technologies are the highest priorities for design engineers.

Teledyne e2v HiRel GaN screening, baseline control, and a 10-year longevity support program will give customers the reliability and availability assurance they need when addressing demanding military, space, avionics, and related HiRel applications.

“Releasing a HiRel 650V GaN FET is an industry milestone, giving design engineers more margin in the most demanding space and military COTS applications,” said Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “The non-ceramic package will allow customers to benefit from the low weight and efficient GaNPX package for the best performance in these stringent applications.”

For demanding high power applications, GaN power FET technology is the newest, most efficient solution for customers. The new 650V part builds on this by offering additional differentiating benefits, including:

  • Very high switching frequency
  • SWaP – the device is a offered in a very small package
  • High voltage and high current
  • High energy density
  • Modular Flexibility – the parts can be used in parallel to increase current

Teledyne HiRel Electronics is able to offer samples of the new device available for review, and shipping will commence in November.