2352W per Cubic Inch from 7.26mm High Isolated DC-DC

Vicor Corporation announced the expansion of its BCM series of dc-dc converters utilizing the Converter housed in Package™ (ChiP) power component format. The new BCM6123TD1E2663Txx is a high-density, high-efficiency, fixed ratio dc-dc converter module in a ChiP package, which operates from a 384Vdc nominal input and delivers a Safety Extra Low Voltage (SELV) 24V, 62.5A secondary output. The new BCM 6123 ChiP features 4242Vdc isolation and is offered in a through-hole form factor measuring 61mm x 23mm x 7.26mm.

The introduction of the new BCM6123TD1E2663Txx expands Vicor’s family of high voltage bus converters to include K=1/8 (384Vin to 48Vnom), K=1/32 (384Vin to 12Vnom), and the new K=1/16 (384Vin to 24Vnom) modules. Targeting industrial, telecom, and lighting applications, Vicor’s family of high voltage bus converters give system designers a simple and cost effective means to create common bus voltages of 12V, 24V, and 48V directly from 384Vdc.

Based on the patented Sine-Amplitude Converter topology, high voltage BCM ChiPs are able to reach peak efficiencies of 98% and achieve power densities up to 2400W/in³. These flexible modules can be easily paralleled into high power arrays and outputs can be put in series to achieve higher Vout. Parallel operation can support multi-kW arrays.

In addition, the high voltage BCMs are offered with either analog or PMBus digital signal interface and all have an operating temperature range of -40 to 100 degrees C. Leveraging the thermal and density benefits of Vicor’s ChiP packaging technology, the BCM offers flexible thermal management options with very low top and bottom side thermal impedances.

High voltage BCMs allow designers to reduce the amount of bulk capacitance needed at the load by utilizing the Sine-Amplitude Converter’s low ac impedance relative to the down-stream regulator, effectively ‘reflecting’ the capacitance across the module. With the new K=1/16 module, 500µF of 24V point-of-load capacitance can be effectively provided by 2µF on the module’s primary side.