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TI Introduces First Single-Chip Battery Management Device to Protect Power Tools and E-Bikes

TI Introduces First Single-Chip Battery Management Device to Protect Power Tools and E-Bikes

Seiko Instruments Temperature Sensor IC Provides PWM Output Signal

Seiko Instruments Temperature Sensor IC Provides PWM Output Signal

Micropelt Opens First Thermoelectric Wafer and Chip Production in Germany

Micropelt Opens First Thermoelectric Wafer and Chip Production in Germany


News Jun 28, 2011 by Jeff Shepard
Cree Releases 1200V Family of Silicon Carbide Schottky Diodes for Power Conversion Applications

Cree Releases 1200V Family of Silicon Carbide Schottky Diodes for Power Conversion Applications

National Semiconductor Introduces First 100V Half-bridge Gate Driver for Enhancement-mode Gallium-Nitride Power FETs

National Semiconductor Introduces First 100V Half-bridge Gate Driver for Enhancement-mode Gallium-Nitride Power FETs

Seiko Instruments Introduces 180nA Temperature Switch IC

Seiko Instruments Introduces 180nA Temperature Switch IC

Maxim Compact Energy-Harvesting and Power-Management IC Enables Low-Power Wireless Devices

Maxim Compact Energy-Harvesting and Power-Management IC Enables Low-Power Wireless Devices

Fairchild Semiconductor  Expands PowerTrench MOSFET Family with Industrial Type Packages

Fairchild Semiconductor Expands PowerTrench MOSFET Family with Industrial Type Packages

National Semiconductor High-Brightness LED Driver Simplifies Area-lighting Design

National Semiconductor High-Brightness LED Driver Simplifies Area-lighting Design

Renesas Electronics Introduces LED Driver IC for LED Backlit LCD Televisions

Renesas Electronics Introduces LED Driver IC for LED Backlit LCD Televisions

Cree Provides SiC MOSFET Energy Conservation to 3-10kW Solar, Power Supply and Motor Drive Applications

Cree Provides SiC MOSFET Energy Conservation to 3-10kW Solar, Power Supply and Motor Drive Applications

U.S. Antitrust Review Ends for TI Acquisition of National Semiconductor

U.S. Antitrust Review Ends for TI Acquisition of National Semiconductor


News May 22, 2011 by Jeff Shepard
SiC Devices Intro’d at PCIM Europe

SiC Devices Intro’d at PCIM Europe

Power Integrations Doubles Power Output Capability of LinkZero-AX Zero-Standby Switcher IC Family

Power Integrations Doubles Power Output Capability of LinkZero-AX Zero-Standby Switcher IC Family

Allegro MicroSystems Introduces a Fully Integrated DMOS Full-Bridge Motor Driver IC

Allegro MicroSystems Introduces a Fully Integrated DMOS Full-Bridge Motor Driver IC

Marvell Introduces First Single Chip Dual-String Dimmable LED Lighting Controller Family

Marvell Introduces First Single Chip Dual-String Dimmable LED Lighting Controller Family

IR Introduces First PFC and Ballast Control IC Integrated in an 8-Pin SO-8 Package for Lighting Applications

IR Introduces First PFC and Ballast Control IC Integrated in an 8-Pin SO-8 Package for Lighting Applications

IXYS and GMCH Enter Into Agreement for Chip Manufacturing

IXYS and GMCH Enter Into Agreement for Chip Manufacturing


News May 08, 2011 by Jeff Shepard
Cree Announces Signing of a Global SiC Materials License Agreement with Nippon Steel

Cree Announces Signing of a Global SiC Materials License Agreement with Nippon Steel


News Apr 25, 2011 by Jeff Shepard
Freescale Semiconductor Announces First Quarter 2011 Results

Freescale Semiconductor Announces First Quarter 2011 Results


News Apr 24, 2011 by Jeff Shepard