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LDOs in Breakthrough Bumpless Chip-Scale Package

LDOs in Breakthrough Bumpless Chip-Scale Package

Mouser Signs Global Agreement with Torex Semiconductor

Mouser Signs Global Agreement with Torex Semiconductor


News Aug 01, 2016 by Jeff Shepard
Anti-Surge Thick Film Chip Resistors

Anti-Surge Thick Film Chip Resistors

Gate Drivers for IGBTs and SiC MOSFETs

Gate Drivers for IGBTs and SiC MOSFETs

Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits


News Jul 27, 2016 by Jeff Shepard
LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.


Kettering tapped to Develop SiC EV Charger for PowerAmerica

Kettering tapped to Develop SiC EV Charger for PowerAmerica


News Jul 20, 2016 by Jeff Shepard
1200V SiC MOSFET in SOT227 MiniBLOC

1200V SiC MOSFET in SOT227 MiniBLOC

Operating SiC Power Devices at 300 Degrees C

Operating SiC Power Devices at 300 Degrees C


News Jul 18, 2016 by Jeff Shepard
Illumination LED Driver IC with Single-Wire Input

Illumination LED Driver IC with Single-Wire Input

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Toshiba Electronics Europe has announced an addition to its range of H-bridge [1] driver ICs for brushed DC and stepper motors


SiC-based Power Module includes BJTs and Drivers

SiC-based Power Module includes BJTs and Drivers

Open-Source RISC-V Chip Platforms

Open-Source RISC-V Chip Platforms


News Jul 11, 2016 by Jeff Shepard
30V / 1.5A Photorelays for Semiconductor Testers

30V / 1.5A Photorelays for Semiconductor Testers

SiC IC Design Process Model Grant from NASA

SiC IC Design Process Model Grant from NASA


News Jul 10, 2016 by Jeff Shepard
1700V SiC MOSFET Optimized for Industrial Converters

1700V SiC MOSFET Optimized for Industrial Converters

Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges


News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC