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Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

News Jul 27, 2016 by Jeff Shepard
LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.

Technical Articles Jul 26, 2016 by Raffael Schnell
Kettering tapped to Develop SiC EV Charger for PowerAmerica

Kettering tapped to Develop SiC EV Charger for PowerAmerica

News Jul 20, 2016 by Jeff Shepard
1200V SiC MOSFET in SOT227 MiniBLOC

1200V SiC MOSFET in SOT227 MiniBLOC

new products Jul 19, 2016 by Jeff Shepard
Operating SiC Power Devices at 300 Degrees C

Operating SiC Power Devices at 300 Degrees C

News Jul 18, 2016 by Jeff Shepard
Illumination LED Driver IC with Single-Wire Input

Illumination LED Driver IC with Single-Wire Input

new products Jul 18, 2016 by Jeff Shepard
Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Toshiba Electronics Europe has announced an addition to its range of H-bridge [1] driver ICs for brushed DC and stepper motors

new products Jul 17, 2016 by Toshiba Europe
SiC-based Power Module includes BJTs and Drivers

SiC-based Power Module includes BJTs and Drivers

new products Jul 14, 2016 by Jeff Shepard
Open-Source RISC-V Chip Platforms

Open-Source RISC-V Chip Platforms

News Jul 11, 2016 by Jeff Shepard
30V / 1.5A Photorelays for Semiconductor Testers

30V / 1.5A Photorelays for Semiconductor Testers

new products Jul 11, 2016 by Jeff Shepard
SiC IC Design Process Model Grant from NASA

SiC IC Design Process Model Grant from NASA

News Jul 10, 2016 by Jeff Shepard
1700V SiC MOSFET Optimized for Industrial Converters

1700V SiC MOSFET Optimized for Industrial Converters

new products Jul 06, 2016 by Jeff Shepard
Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges

News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

new products Jun 29, 2016 by Jeff Shepard
Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

new products Jun 28, 2016 by Jeff Shepard
Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

new products Jun 27, 2016 by Jeff Shepard
25A / 650V Hermetic SiC FETs handle 225 Degrees C

25A / 650V Hermetic SiC FETs handle 225 Degrees C

new products Jun 21, 2016 by Jeff Shepard
Delivering first SiC Intelligent Power Modules to Thales

Delivering first SiC Intelligent Power Modules to Thales

This article discusses the announcement of the delivery of the CISSOID's first prototype of 3-phase 1200V/100A SiC MOSFET IPMs to Thales…

new products Jun 16, 2016 by CISSOID
WPG Americas pens Distribution Agreement with Seoul Semiconductor

WPG Americas pens Distribution Agreement with Seoul Semiconductor

News Jun 14, 2016 by Jeff Shepard
Keeping Cool with a Black Semiconductor

Keeping Cool with a Black Semiconductor

News Jun 13, 2016 by Jeff Shepard