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SiC-based Power Module includes BJTs and Drivers

SiC-based Power Module includes BJTs and Drivers

new products Jul 14, 2016 by Jeff Shepard
Open-Source RISC-V Chip Platforms

Open-Source RISC-V Chip Platforms

News Jul 11, 2016 by Jeff Shepard
30V / 1.5A Photorelays for Semiconductor Testers

30V / 1.5A Photorelays for Semiconductor Testers

new products Jul 11, 2016 by Jeff Shepard
SiC IC Design Process Model Grant from NASA

SiC IC Design Process Model Grant from NASA

News Jul 10, 2016 by Jeff Shepard
1700V SiC MOSFET Optimized for Industrial Converters

1700V SiC MOSFET Optimized for Industrial Converters

new products Jul 06, 2016 by Jeff Shepard
Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges

News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

new products Jun 29, 2016 by Jeff Shepard
Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

new products Jun 28, 2016 by Jeff Shepard
Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

new products Jun 27, 2016 by Jeff Shepard
25A / 650V Hermetic SiC FETs handle 225 Degrees C

25A / 650V Hermetic SiC FETs handle 225 Degrees C

new products Jun 21, 2016 by Jeff Shepard
Delivering first SiC Intelligent Power Modules to Thales

Delivering first SiC Intelligent Power Modules to Thales

This article discusses the announcement of the delivery of the CISSOID's first prototype of 3-phase 1200V/100A SiC MOSFET IPMs to Thales…

new products Jun 16, 2016 by CISSOID
WPG Americas pens Distribution Agreement with Seoul Semiconductor

WPG Americas pens Distribution Agreement with Seoul Semiconductor

News Jun 14, 2016 by Jeff Shepard
Keeping Cool with a Black Semiconductor

Keeping Cool with a Black Semiconductor

News Jun 13, 2016 by Jeff Shepard
SDK Expands High-Grade SiC Epitaxial Wafer Capacity

SDK Expands High-Grade SiC Epitaxial Wafer Capacity

News Jun 08, 2016 by Jeff Shepard
Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.

Technical Articles Jun 07, 2016 by Alex Lidow
Metal Composite High-Current Chip Inductors

Metal Composite High-Current Chip Inductors

new products Jun 05, 2016 by Jeff Shepard
Overcoming Challenges in Driving Silicon Carbide Power Modules

Overcoming Challenges in Driving Silicon Carbide Power Modules

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.

Technical Articles May 31, 2016 by Nitesh Satheesh
SIC FETs enable Cure for EV Range Anxiety

SIC FETs enable Cure for EV Range Anxiety

News May 30, 2016 by Jeff Shepard
Buffalo to Investigate GaO Ultra-Wide Bandgap Semis

Buffalo to Investigate GaO Ultra-Wide Bandgap Semis

News May 30, 2016 by Jeff Shepard
AEC-Q200 Qualified Thick-Film Chip Resistors

AEC-Q200 Qualified Thick-Film Chip Resistors

new products May 23, 2016 by Jeff Shepard