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Ultra-Low Power Consumption Voltage Detection IC with MOSFET

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

new products Jan 21, 2018 by Paul Shepard
Flip-Chip Packaging Solution for Premium LED Lighting

Flip-Chip Packaging Solution for Premium LED Lighting

News Jan 18, 2018 by Paul Shepard
Peregrine Semiconductor Is Now pSemi

Peregrine Semiconductor Is Now pSemi

News Jan 17, 2018 by Paul Shepard
Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

new products Jan 16, 2018 by Paul Shepard
1200V SiC Schottky Diodes Rated for 8A, 15A and 20A

1200V SiC Schottky Diodes Rated for 8A, 15A and 20A

new products Jan 16, 2018 by Paul Shepard
Expanded SiC Schottky Diode Line Reduces Switching Losses Increases Efficiency and Robustness

Expanded SiC Schottky Diode Line Reduces Switching Losses Increases Efficiency and Robustness

Littelfuse, Inc. introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family

new products Jan 16, 2018 by Littelfuse
3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters

3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters

This article highlights the benefits of using the new Full SiC MOSFETS in traction applications and flexible converter designs.

Technical Articles Jan 13, 2018 by Nils Soltau
Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts

Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts

News Jan 11, 2018 by Paul Shepard
Next Generation Silicon Carbide Power Device with 3DSiC Technology

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…

new products Jan 11, 2018 by Ascatron
Dynex Launches High-Voltage Semiconductor Foundry Business

Dynex Launches High-Voltage Semiconductor Foundry Business

News Jan 10, 2018 by Paul Shepard
NPC Modules with Latest IGBT Chip Tech for up to 120kVA

NPC Modules with Latest IGBT Chip Tech for up to 120kVA

new products Jan 10, 2018 by Paul Shepard
High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers…

new products Jan 10, 2018 by Toshiba Europe
IC Process with Ultra-High Breakdown Voltage for Digital Isolators

IC Process with Ultra-High Breakdown Voltage for Digital Isolators

News Jan 08, 2018 by Paul Shepard
Energous & Dialog Unveil Wireless Charging 2.0 IC

Energous & Dialog Unveil Wireless Charging 2.0 IC

new products Jan 07, 2018 by Paul Shepard
Three-Phase MOSFET Driver IC with On-Board Regulator

Three-Phase MOSFET Driver IC with On-Board Regulator

new products Jan 01, 2018 by Paul Shepard
Half-Bridge Reference Design for Evaluating Si, SiC and GaN Power Devices

Half-Bridge Reference Design for Evaluating Si, SiC and GaN Power Devices

new products Dec 22, 2017 by Paul Shepard
Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

new products Dec 18, 2017 by Paul Shepard
Temperature Sensor IC for Wireless Tags Runs 1 Year on 30mAh Battery

Temperature Sensor IC for Wireless Tags Runs 1 Year on 30mAh Battery

News Dec 18, 2017 by Paul Shepard
Silicon-Carbide Enables UPS to Achieve Highest Energy Star Listing

Silicon-Carbide Enables UPS to Achieve Highest Energy Star Listing

News Dec 12, 2017 by Paul Shepard
Diamond and SiC Bonded at Room Temp. Enabling Radar Performance Boost

Diamond and SiC Bonded at Room Temp. Enabling Radar Performance Boost

News Dec 08, 2017 by Paul Shepard