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New Dual-Output Gate Driver Evaluation Board from SemiSouth for Microsemi and Other Power Modules

New Dual-Output Gate Driver Evaluation Board from SemiSouth for Microsemi and Other Power Modules

new products Oct 18, 2011 by Jeff Shepard
Allegro MicroSystems Introduces New Automotive, Low Side MOSFET Pre-Driver IC

Allegro MicroSystems Introduces New Automotive, Low Side MOSFET Pre-Driver IC

new products Oct 17, 2011 by Jeff Shepard
IXYS and Clare Introduce New Optically Coupled Driver for Power MOSFETs, IGBTs and Thyristors

IXYS and Clare Introduce New Optically Coupled Driver for Power MOSFETs, IGBTs and Thyristors

new products Oct 17, 2011 by Jeff Shepard
Infineon Succeeds in Producing Chips on New 300-Millimeter Thin Wafer Technology for Power Semiconductors

Infineon Succeeds in Producing Chips on New 300-Millimeter Thin Wafer Technology for Power Semiconductors

News Oct 10, 2011 by Jeff Shepard
Cree Announces New Z-Rec Silicon Carbide Schottky Diodes for Solar Micro Inverter Designs

Cree Announces New Z-Rec Silicon Carbide Schottky Diodes for Solar Micro Inverter Designs

new products Oct 10, 2011 by Jeff Shepard
ROHM Semi Announces Name Change of Subsidiary OKI Semi to Lapis Semiconductor

ROHM Semi Announces Name Change of Subsidiary OKI Semi to Lapis Semiconductor

News Oct 09, 2011 by Jeff Shepard
RF Micro Devices Announces Formation of Compound Semiconductor Group

RF Micro Devices Announces Formation of Compound Semiconductor Group

News Oct 06, 2011 by Jeff Shepard
austriamicrosystems Extends High-Voltage CMOS Technology Towards Power Grid Applications

austriamicrosystems Extends High-Voltage CMOS Technology Towards Power Grid Applications

new products Oct 06, 2011 by Jeff Shepard
Analog Devices Digital Isolator Packaging Meets Safety Requirements in Medical & Industrial Applications

Analog Devices Digital Isolator Packaging Meets Safety Requirements in Medical & Industrial Applications

new products Oct 05, 2011 by Jeff Shepard
Hyundai Selects Infineon HybridPACK 1 Power Module for Its Current Hybrid Vehicle Generations

Hyundai Selects Infineon HybridPACK 1 Power Module for Its Current Hybrid Vehicle Generations

News Oct 04, 2011 by Jeff Shepard
Powerex Introduces Low Profile Split Dual Si/SiC Hybrid IGBT Modules Featuring Multiple Circuit Topologies

Powerex Introduces Low Profile Split Dual Si/SiC Hybrid IGBT Modules Featuring Multiple Circuit Topologies

new products Oct 04, 2011 by Jeff Shepard
Fairchild Next Generation Power Switch Series Meets 2013 ErP Lot 6 Standby Power Regulations With One Chip

Fairchild Next Generation Power Switch Series Meets 2013 ErP Lot 6 Standby Power Regulations With One Chip

new products Oct 03, 2011 by Jeff Shepard
Alpha and Omega Semi Expands EZBuck Product Portfolio

Alpha and Omega Semi Expands EZBuck Product Portfolio

new products Oct 02, 2011 by Jeff Shepard
Atmel to Acquire ADD Semiconductor; a Developer of Power Line Communications Technology

Atmel to Acquire ADD Semiconductor; a Developer of Power Line Communications Technology

News Sep 27, 2011 by Jeff Shepard
GEM Services Announces Joint Venture With Mitsubishi Electric to Build Power Semiconductor Modules in China

GEM Services Announces Joint Venture With Mitsubishi Electric to Build Power Semiconductor Modules in China

News Sep 27, 2011 by Jeff Shepard
Bourns and Magnachip Announce Volume Ramp of TBU Series of High-Speed Circuit Protection Devices

Bourns and Magnachip Announce Volume Ramp of TBU Series of High-Speed Circuit Protection Devices

new products Sep 27, 2011 by Jeff Shepard
Researchers Unveil New Gallium Nitride Transistor Technology

Researchers Unveil New Gallium Nitride Transistor Technology

News Sep 22, 2011 by Jeff Shepard
Texas Instruments Completes Acquisition of National Semiconductor

Texas Instruments Completes Acquisition of National Semiconductor

News Sep 22, 2011 by Jeff Shepard
SemiSouth 1200V/5A SiC Diodes Offered in True Surface Mount DPAK Packaging

SemiSouth 1200V/5A SiC Diodes Offered in True Surface Mount DPAK Packaging

new products Sep 18, 2011 by Jeff Shepard
MagnaChip to Include Specialty High Density Capacitor Processes With Its Standard CMOS Mixed Signal Process

MagnaChip to Include Specialty High Density Capacitor Processes With Its Standard CMOS Mixed Signal Process

News Sep 14, 2011 by Jeff Shepard