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Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

new products Feb 26, 2019 by Paul Shepard
Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…

new products Feb 26, 2019 by Infineon Technologies
Simplified EMC Compliance Using Line Inductors Optimized for RECOM DC-DCs

Simplified EMC Compliance Using Line Inductors Optimized for RECOM DC-DCs

new products Feb 25, 2019 by Paul Shepard
Libelium and Ericsson Launch First NB-IoT Developer Kits

Libelium and Ericsson Launch First NB-IoT Developer Kits

News Feb 25, 2019 by Paul Shepard
Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

new products Feb 25, 2019 by Scott McMahan
SK Innovation to Use PolyPlus’ Glass Separator Tech for Li Battery Development

SK Innovation to Use PolyPlus’ Glass Separator Tech for Li Battery Development

News Feb 25, 2019 by Scott McMahan
Energous Collaborating with Vivo on Smartphone Wireless Charging-at-a-Distance

Energous Collaborating with Vivo on Smartphone Wireless Charging-at-a-Distance

News Feb 25, 2019 by Scott McMahan
MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

News Feb 25, 2019 by Scott McMahan
Qualcomm Announces Quick Charge Technology for Wireless Power

Qualcomm Announces Quick Charge Technology for Wireless Power

News Feb 25, 2019 by Scott McMahan
IoT Cube BOX Gateway Significantly Cuts Development Times

IoT Cube BOX Gateway Significantly Cuts Development Times

new products Feb 25, 2019 by Paul Shepard
Discovery and Evaluation Kits for USB-C Power Delivery 3.0 Protocol

Discovery and Evaluation Kits for USB-C Power Delivery 3.0 Protocol

new products Feb 25, 2019 by Scott McMahan
Multi-Device Calibrator for International Standards

Multi-Device Calibrator for International Standards

new products Feb 25, 2019 by Scott McMahan
Wind Power Capacity Worldwide Reaches 600 GW 53.9 GW added in 2018

Wind Power Capacity Worldwide Reaches 600 GW 53.9 GW added in 2018

The overall capacity of all wind turbines installed worldwide by the end of 2018 reached 600 Gigawatt, according to preliminary statistics recently…

new products Feb 25, 2019 by World Wind Energy Association
Overvoltage Protection for RTD-Based Measurement Systems

Overvoltage Protection for RTD-Based Measurement Systems

This article focuses on how to provide a total solution for multiwire RTD modules with overvoltage protection function and overvoltage protection…

Technical Articles Feb 25, 2019 by Yao Zhao
Digital Compensator Design for LLC Resonant Converter

Digital Compensator Design for LLC Resonant Converter

Industry White Papers In partnership with Microchip Technology Inc.
Infineon, Xilinx, and Xylon Partner on FPGA Solutions

Infineon, Xilinx, and Xylon Partner on FPGA Solutions

News Feb 23, 2019 by Scott McMahan
GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET

GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET

News Feb 23, 2019 by Scott McMahan
Strip-and-Poke-Insertable WTW Connectors for 12–18AWG Wire

Strip-and-Poke-Insertable WTW Connectors for 12–18AWG Wire

new products Feb 23, 2019 by Scott McMahan
Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

News Feb 22, 2019 by Scott McMahan
EEMBC Standardizes CoreMark Energy Measurement with New Benchmark

EEMBC Standardizes CoreMark Energy Measurement with New Benchmark

News Feb 22, 2019 by Paul Shepard