Toshiba to Expand Discrete Devices Capacity

Toshiba Corp. (Japan) announced that it will increase the MOSFET assembly and test capacity of its Himeji, Japan, operations and Buzen Toshiba Electronics Corp. Capacity will be increased from the current 30 million units a month to about 45 million units a month. In addition, the company will also boost LED assembly capacity from 70 million units to about 100 million units a month at Buzen Toshiba Electronics and Toshiba Semiconductor (Thailand) Co. Ltd. Total investment is estimated at ¥10.0 billion ($84.3 million at ¥118.59 equals US$1.00).