Tessera Reports Licensing Agreement with SANYO

September 23, 2003 by Jeff Shepard

Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that Sanyo Electric Co. Ltd. and Tessera have signed a new licensing agreement. Under this agreement, SANYO has licensed Tessera's semiconductor packaging technology to package semiconductor devices utilized in a variety of consumer electronic products.

The addition of SANYO to Tessera's licensee family reflects Tessera's strategy to license packaging technology to a broad range of electronics companies. Included in Tessera's license with SANYO are over 150 patents covering Tessera's Compliant Chip® technology, which covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in face-down, face-up, fold-over, stacked, and system-in-package formats. The package types are marketed by Tessera as micronBGA® for face-down orientations, micronBGA-F for face-up orientations, and micronZ™ for multi-chip solutions.