Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, and IXYS Corporation have signed an agreement to jointly target the growing IoT market. The companies will initially address geographies such as Korea, Japan and Europe, leveraging IXYS' channels and sensor technologies, and Telink's unified IoT system-on-chip solutions.
Telink Semiconductor is focused on IoT chipset solutions for smart homes, with a product portfolio that addresses all major communications protocols including Bluetooth Smart, ZigBee, 6LoWPAN/Thread and HomeKit. The company has a leading position in BLE (Bluetooth low energy) mesh based solutions, with annual sales of over 100 million RMB and major customers such as GE, Philips and Cisco.
Telink's CEO, Wenjun Sheng, said, “We are pleased to be working with IXYS. This partnership will allow us to extend the reach of networked small devices for the home and industrial markets, as well as strengthen IXYS's product portfolio.â€
Timothy Kwon, CEO of Radiopulse which is a IXYS subsidiary company, added, “The huge growth in connected devices both now and forecast for the future puts significant challenges on device manufacturers for low cost, low power, and highly integrated chip solutions. Our position in the communications and power semiconductor markets combined with Telink’s strength in the home automation market, and especially Bluetooth low energy, puts us in an excellent position for the IoT market.â€
