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Ramtron Intros Lead-Free Packaging for SOICs

August 26, 2003 by Jeff Shepard

Semiconductor maker Ramtron International Corp. (Colorado Springs, CO) announced that all eight-pin, SOIC, ferro-electric random access memory (FRAM) products are now available in environmentally friendly "green" packaging. Responding to the industry's drive toward the lead-free packaging of electronic products, Ramtron has removed lead (Pb) from finished packaging as well as brominated, flame-retarding compounds from encapsulants and substrates.

The company's packages meet or exceed the requirements of the joint IPC/JEDEC standard, J-STD-020B, and are compliant with European Union requirements set to take effect in 2006. The European Commission Directives, Japanese legislation and worldwide market pressures have spearheaded the move toward the environmentally friendly manufacturing of electronic components.

"A growing number of our key customers in Asia, Japan and Europe have requested FRAM memory products in environmentally friendly packaging," said Mike Alwais, Ramtron vice president, FRAM Products. "Integrating green packaging into our product line is further evidence of our ongoing commitment to meeting the changing needs of our customers and our dedication to continuous product improvement."