News

M-Flex and Mobility Electronics Sign Technology Agreements

March 29, 2005 by Jeff Shepard

Multi-Fineline Electronix Inc. (M-Flex), a provider of flexible printed circuit and value-added component assembly solutions, and Mobility Electronics Inc. (Scottsdale, AZ), a provider of portable computing solutions for the mobile computer user, announced that they have signed technology development and manufacturing agreements aimed at utilizing M-Flex's component assembly capabilities and new embedding technology to reduce the size and weight of Mobility's universal power adapters for mobile electronic devices, including portable computers.

M-Flex has developed patented technology that embeds the transformers and inductors required in a power adapter into printed circuit boards that also house the other necessary electronics for the device. The technology significantly increases the packaging density of the end product and substantially reduces the size of the circuitry.

The joint development agreement will focus on leveraging M-Flex's new technology and Mobility's experience and technology in the power adapter market to create key components for use in Mobility's universal power adapters. The first products utilizing the technology are expected to be introduced in early- to mid-2006.

Based on the terms of the agreements, Mobility and M-Flex will share ownership of the jointly developed technology. In addition, during the term of the agreements, Mobility will exclusively purchase components that utilize M-Flex and jointly developed technology from M-Flex, and Mobility will have the worldwide exclusive right to use the technology in mobile power adapters that utilize Mobility's patented itip technology.