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Infineon Highlights Energy-Efficient Power Management

March 03, 2016 by Power Pulse1595211359

At the Applied Power Electronics Conference (APEC), Infineon Technologies will highlight its benchmark power management solutions that enable customers to increase efficiency, power density and system performance cost effectively for electronic applications. APEC 2016 takes place at the Long Beach Convention Center, California from March 20 - 24th, 2016.

Infineon’s technical team will showcase silicon- and GaN-based demonstrations at Booth 1917. The solutions support applications including dc-dc computing, industrial automation and welding, lighting, motor control, solar, wireless power, Switched Mode Power Supplies and uninterruptable power supplies. Additionally, Infineon’s experts will participate in the following Industry and Technical Sessions and Exhibitor presentations.

Tuesday March 22, 2016 Wide Bandgap Semiconductors (Co-chair: Odile Ronat), IS04, 203AB, Tuesday March 22, 8.30-11.55 a.m.; MOSFET Driver IC Solutions from Infineon Technologies (Hubert Baierl), Tuesday March 22, 1:30-2:00 p.m.

Wednesday March 23, 2016 Using web-based tools for the thermal design of a power converter - Ahmed Zaghlol (Mersen), Jeremy Howes (Tesla Energy), David Levett (Infineon), Greg Shendel (Parker SSD Drives), IS05, Thermal Management, 201A, Wednesday March 23, 8:30-10:10 a.m.; Modeling and Simulation (Co-Chair: Cahit Gezgin), IS06, 201B, Wednesday March 23, 8:30-10:10 a.m.; Design and Implementation of an LLC-ZCS Converter for Hybrid/Electric Vehicles (Davide Giacomini), IS12, Aircraft, Medium & Heavy Duty Drive Cycles, Mining, Fuel Cells, Converters and Market Trends, 203AB, Wednesday March 23, 14:00-17:25 p.m.; From the Board to the Data Center (Co-Chair: Wisam Moussa), IS10, 201B, Wednesday March 23, 14:00-17:25p.m.

Thursday March 24, 2016 GaN in a Silicon World: Competition or Coexistence? (Tim McDonald), IS16, Power Semiconductors Enabling Next Generation Applications, 203AB, Thursday March 24, 8:30-11:30 a.m.; Advanced Components and Devices (Co-Chair: Abhijit Pathak), D08, Poster Area, Thursday March 24, 11:30-14:00 a.m.; Advantages and optimized control of Reverse Conducting Diode Controlled RCDC IGBTs (David Levett and Tim Frank), IS20, Active Devices, 203AB, Thursday March 24, 14:00-17:25 p.m.; Design improvements to the PrimePACKâ„¢ IGBT module for Commercial, Construction and Agricultural Vehicle CAV traction drives (David Levett and Tim Frank), IS20, Active Devices, 203AB, Thursday March 24, 14:00-17:25 p.m.; A new high power IGBT module package (XHP) (Tim Frank and David Levett), IS20, Active Devices, 203AB, Thursday March 24, 14:00-17:25 p.m.; Envelope Tracking and Resonant Conversion (Co-Chair: Davide Giacomini), T45, Room 9, Thursday March 24, 14:00-17:30 p.m.; Component Modeling (Co-Chair: Abhijit Pathak), T42, Room 6, Thursday March 24, 14:00-17:30 p.m.