Ericsson Technology Licensing (Sweden) announced that they have signed a license agreement with STMicroelectronics Inc. (ST, Geneva, Switzerland) for Ericsson's new Bluetooth baseband core, which implements the complete range of mandatory Bluetooth 1.2 features. ST will embed the Ericsson Core Bluetooth Baseband Platform Q-E1 in future Bluetooth products, starting with a single-chip Bluetooth solution with full v1.2 functionality that is currently in development.
Products compliant with the Bluetooth v1.2 specification offer features such as faster connection times, enhanced voice quality and adaptive frequency hopping, for improved coexistence with other wireless technologies. ST's new chip will be fully compliant with the new standard, backwards compatible with all v1.1 solutions and interoperable with all current Bluetooth solutions.
ST's new Bluetooth designs benefit from the advanced capabilities of the company's low-power HCMOS9 (0.13 micron) technology, such as low leakage currents, translating to a superior battery life performance. The technology allows seamless integration of RF, power management and digital functionality into one silicon die.