Digi-Key has become a Diamond Sponsor of Darnell’s Power Forum (DPF ’11). DPF ’11, to be hosted in San Jose, California, September 26-28, is an exciting event that focuses on "advancing power technologies that matter" for the successful development of nextgeneration power systems. There is tremendous synergy possible from discussions broadly focused on power management, energy efficiency, advanced components, energy storage, smart grid innovations and more.
"We are happy to have an industry-leader like Digi-Key as a Diamond Sponsor of Darnell’s Power Forum," stated Jeff Shepard, President of Darnell Group. "It’s natural that Digi-Key should sponsor Darnell’s Power Forum. Digi-Key is a solutions-oriented organization and DPF is a solutions-oriented event, and both have a strong emphasis on practical advances in power electronics."
Darnell’s Power Forum will feature several primary areas of focus: Advanced Components, Digital Power, Energy Harvesting, High-Efficiency Power Conversion, Developments in PwrSiP/PwrSoC Technologies and Innovation for the Smart Grid. Within each of these broad areas will be multiple topics and application areas. A call for papers has been issued for:
Advanced Components: Topics may include: Latest developments in power conversion components to support advanced designs such as semiconductor devices, advanced packaging, interconnect, thermal management, magnetic devices, capacitors, batteries, ultracapacitors, sensors, new materials, integrated passives, and so on.
Digital Power: Topics may include: Technology-focused discussions including controllers and control loops, communications, power management, stability analysis, efficiency optimization, design tools, simulation and modeling, topologies, system partitioning between analog and digital, power quality and EMC, and so on.
Energy Harvesting: Topics may include: energy harvesting technologies, thin-film batteries, long-life secondary batteries, energy storage, advanced power conversion, micro fuel cells, optimizing system energy efficiencies, mesh networks, wireless sensor and control systems, industrial/building automation, system integration issues, RF powering considerations, system architectures, and so on.
High-Efficiency Power Conversion: Topics may include: High-frequency power conversion, high temperature operation, power system-in-chip solutions, power system-in-package solutions, high density packaging developments, optimizing converter efficiencies, new topologies, advanced (analog or digital) control techniques, parasitics, EMI/EMC considerations, and so on.
Innovation for the Smart Grid: Topics may include: Integration of distributed generation resources, micro grids, power systems communications, power quality, instrumentation and monitoring, enabling demand side management, supporting plug-in hybrid vehicles, large-scale energy storage, and so on.
PwrSiP/PwrSoC: Topics may include: miniaturization and integration of passive components, advances in high-frequency power conversion, new topologies and architectures, developments in packaging, multi-Megahertz switching, efficiency optimization, and so on.
In each case, the types of papers being sought include: Case studies/industry examples, Design techniques and tools, and Technology developments.
The DPF ’11 web site is here.
