Chinese City of Ningbo to Build Semiconductor Encapsulation District
January 11, 2001 by Jeff Shepard
The city of Ningbo, located in east China's Zhejiang province, recently announced that it is to build China's first semiconductor encapsulation district.
Covering 900,000 square meters, the district is within Ningbo's development zone. It will focus its products on the packaging of chips for mobile communications, industrial control and home appliances.
They expect to account for 15 percent of the packaging volume in the country in three to five years.