Each year, PowerPulse provides readers extensive coverage of important industry events, spanning the globe from Asia to Europe and North America, including the IEEE Applied Power Electronics Conference, PCIM Europe, Solar Power International, Techno Frontier Japan, Consumer Electronics Show and electronica. The coverage typically starts running in advance of the event and continues with wrap-up stories after the event has concluded. The following are the ten most-read stories from electronica 2016:
#10: Online Prototyping Made Easy with Infineon Designer
Starting at electronica 2016, Infineon Technologies introduces Infineon Designer: the first online prototyping engine combining analog and digital simulation functionalities in an internet application. Requiring a web browser only, it is a perfect match for supporting customers in selecting the right product for a defined application. Infineon Designer works intuitively in a very short time, and neither installation nor licenses are needed. More.
#9: Torex Reveals Products for Introduction in 2017
Last week at the electronica 2016 event, b>Torex Semiconductor revealed product introduction plans for the first part of 2017 that included: the XDL601/02 1.5A micro dc-dc converter with integrated coil approved to AEC-Q1—Grade 2, the XCL225/226 18V 500mA step-down micro dc-dc converter also with integrated coil, the XC9276 ultra-low power step down dc-dc converter with VSET function, and the XC6237, low quiescent current, high-speed LDO voltage regulator. More.
#8: Miniaturized DC-DCs for IGBT & SiC Gate Drives
Murata has released three series of 6W high-isolation dc-dc converters from Murata Power Solutions which, in the form of single devices, are able to provide all gate drive power for half, full, and three-phase bridge circuits, saving space and cost while providing optimum performance.. More.
#7: Torex Introducing Automotive Power Converters at electronica
During electronica, Torex will be introducing a new range of high temperature products, qualified to AECQ100 for the automotive market. The new XD-Q range includes; High performance dc-dc converters, low power consumption voltage regulators, voltage supervisors and load switches for automotive applications. Torex is already a significant supplier to automotive customers in Japan, but this will be the company's first time entering the European automotive market. More.
#6: Design Kit for Faster Integration of 15W Wireless Power
This week, during electronica 2016, Würth Elektronik eiSos is presenting a Qi Standard compatible Wireless Power Design Kit for the medium power range. The "WPC 15W kit" has been jointly developed with the Japanese IC supplier ROHM Semiconductor. Capable of being swiftly integrated into a wireless power product design, it constitutes a fast plug & play solution for developers working on products needing a wireless power supply. More.
#5: Single-Chip USB-C Buck-Boost Battery Chargers
Intersil Corporation introduced last week during electronica 2016 two new USB-Câ„¢ buck-boost battery chargers that support bidirectional power delivery in ultrabooks, tablets, power banks and other mobile products. The single-chip ISL9238 and ISL9238A battery chargers replace competitive two-chip solutions to reduce customer bill of materials (BOM) costs by up to 40%. Both ICs employ Intersil's patented R3â„¢ modulation technology to extend battery life and deliver acoustic noise-free operation, superior light-load efficiency and ultra-fast transient response. More.
#4: GaN Transistor Evaluation Platforms
GaN Systems has launched a daughterboard style evaluation kit to help power design engineers easily evaluate the GaN E-HEMT performance in any system design, along with a universal motherboard (GS665MB-EVB). The family of four daughterboards ranging from 750W to 2,500W consists of two GaN Systems 650V GaN Enhancement-mode HEMTs (E-HEMTs) and all necessary circuits, including half-bridge gate drivers, isolated power supplies and an optional heatsink to form a high performance half bridge power stage. More.
#3: 500V and 700V PLZT Capacitors for Use with GaN and SiC
TDK Corporation today announced they have added new extended range capacitors to their CeraLink™ PLZT ceramic (lead lanthanum zirconate titanate) capacitor line of products. The announcement was made at the electronica 2016 trade show in Munich, Germany. The low profile (LP) types of CeraLink capacitors for SMD soldering are now available with a voltage of 500V and a capacitance of 1µF, or with 700V and 0.5µF. More.
#2: 1200V SiC Trench FETs Reduce RDS(on) by 50%
At the world's leading show for electronics, electronica in Munich, ROHM Semiconductor is presenting its third generation of SiC MOSFETs, SiC Schottky Barrier Diodes (SBDs) and SiC modules. The new devices successfully address the needs of efficient power delivery and are key solutions to reduce loss issues during power conversion. ROHM also introduced power modules incorporating the new trench-type SiC MOSFETs. More.
#1: High-Speed Gate Driver for GaN Power Transistors
Panasonic Corporation today announced that it will start mass production of a high-speed gate driver (AN34092B) optimized for driving its 600V GaN power transistors (X-GaN) in November 2016. The company will also start mass production of two types of X-GaN (the 70 mΩ PGA26E07BA and 190 mΩ PGA26E19BA) and provide solutions in combination with high-speed gate drivers. More.
