IXYS Corp. announced that its wholly owned UK subsidiary, Westcode Semiconductors Ltd., has launched its Next Generation Press-Pack IGBT. Using latest SPT+ technology, the new range features an improved Safe Operating Area (SOA) and reduction in on-state losses of approximately 25% from the previous generation.
Westcode’s Press-Pack IGBT uses a fully hermetic compression contact ceramic capsule in order to assure what the company describes as market leading reliability in the megawatt range in high power applications where efficiency and reliability are foremost.
"We are extremely pleased to be able to offer an improved chip set for the next generation Press-Pack IGBT," commented Bradley Green, Vice President of International Sales for IXYS. "With the press pack platform well into mature mass production, it is the logical next step to incorporate SPT+ technology to advance the efficiency and ruggedness of the portfolio. With appetite for high power density and highest class reliability in high power applications such as medium voltage drives, traction, wind power generators and power quality, Westcode has already seen fast track adoption in the market."
The SPT+ IGBT Press-Packs range from 240 – 2400A collector current and have a collector-emitter voltage of 4,500V. T2400GB45E is an example of a 2.4kA, 4.5kV Press-Pack IGBT that is housed in a ceramic capsule of 168mm outside diameter. Westcode also offers IGBTs with a fully rated internal diode included in the capsule, details of which are available upon request.
