Vishay Offers New SM/PI FunctionPAK Converters/Modules
Vishay Intertechnology Inc. (Malvern, PA) announced that it is making all of its FunctionPAK dc-dc converters and current control modules available in a new surface-mount adaptor board configuration to support engineering prototype assembly. While most production operations can handle the standard FunctionPAK surface-mount BGA configuration, the new SM versions of the FunctionPAK devices will facilitate the assembly process for any engineering lab that finds it difficult to handle the BGA configuration in its prototype assembly lab.
The surface-mount adaptor board is modeled on the BGA package, but the device's contacts have been modified to extend out from under the package to scalloped castellations around the edges of the adaptor board. The SM versions are the second of two FunctionPAK options intended to streamline the design prototype process. Also available is a PI Series of plug-in versions of all devices in the FunctionPAK family, which can be plugged easily into a "bread board" for prototyping and testing. The PI Series devices offer a 0.1-in grid-pin configuration for soldering directly into the circuit board, and a standard socket for the added flexibility of switching different modules in and out of the circuit.
The FunctionPAK low-profile dc-dc converters require no external components to achieve the complete circuit function. Intended primarily for point-of-load converters in intermediate bus architectures, the converters are available as either boost or buck converters with power output up to 15 W and output current up to 4 A. Input voltages from 2.5 V to 6 V are converted to output voltages of 0.8 V to 6 V with efficiencies up to 95 percent.
Intended primarily for prototyping operations, the FunctionPAK SM versions are also available in production quantities. Both samples and production quantities are available now, with lead times of six weeks for larger orders. Pricing for 50-piece quantities starts at $13.53.
