Vicor Introduces Offline VI BRICK BCM Array With Vertical Mount Heatsink
The Brick Business Unit of Vicor Corp. announced the introduction of the VI BRICK BCM Array™. This high-efficiency (typically 95%), high-power (up to 650W), vertically-mounted BCM array provides isolation and conversion from 380V to 12 or 48V for low-voltage distribution near the point of load. The company states that it incorporates the superior technical attributes of VI Chip™ technology in a robust package that facilitates thermal management.
"The combination of a high voltage bus converter with an integrated heatsink that simplifies thermal management and minimizes board space is unique," said Joe Sullivan, Product Marketing Manager, Vicor. "It has already been adopted by major customers."
Well suited for PFC front-end applications providing the capability of a high voltage bus with minimal distribution losses, the VI BRICK BCM Array provides a highly efficient solution for applications using point-of-load (POL) converters to provide multiple output voltages. They are available with 384 and 352 nominal input voltages and output voltages of 11, 12, 44, and 48Vdc. The efficiency and compact size of these modules yields power density up to 290 W/in² and fast transient response. Less capacitance is required for energy storage near the load, which equates to space and cost savings. These models will be available with output power up to 650W in a board space of less than two square inches in a one unit high package. The vertical package orientation also provides better exposure of the heatsink to system airflow.
The new VI BRICK BCM Arrays are well suited for server applications using a PFC front end requiring relatively high power levels with challenging thermal issues. The offline power can be bussed to the motherboard and converted to either 48 or 12V, which minimizes distribution losses, reduces conversion steps, improves efficiency, and reduces overall cost. These products can be used in a wide variety of applications that require high efficiency, high power density, improved thermal management, low noise, fast transient response, and overall design flexibility.
The 384V input modules are immediately available from stock in sample size quantities. Standard lead time for higher quantities is four to six weeks. North American pricing for the VI BRICK BCM Array family is as low as $109 USD in OEM quantities.
