Taiyo Yuden Offers New EIA-0201-Size Multilayer Ferrite Chip Beads With 64% Smaller Surface Area

TAIYO YUDEN (U.S.A.) Inc. announced itd BKP0603 series of 0.6 x 0.3 x 0.3mm multilayer ferrite chip beads for reducing power circuit noise in cell phones and other portable battery-powered electronic equipment. The models now available in the BKP0603 series offer a 64% smaller device footprint (78% smaller by volume) compared to the company’s previous BKP1005 series ferrite chip beads at 1.0 x 0.5 x 0.5mm. For power circuit applications, the company claims that the BKP0603 offers the optimal combination of size, cost and performance.

According to the company, the global cell phone market’s continuing trend toward smaller, more feature-rich products is driving the need for more IC chips, each with its own power supply circuit to optimize power use and reduce consumption. Because more power supply circuits mean a larger consumer product, smaller components in the dc-dc converters and power supply circuits are needed to minimize end device size as much as possible. However reducing the size of the ferrite chip beads also reduces their rated current and dc resistance (RDC) performance, thus minimizing their ability to handle the higher current levels demanded by the application.

Claiming to answer this challenge, TAIYO YUDEN’s material science capability, coupled with what is described as innovative multilayering and printing techniques, resulted in the development of the BKP0603 series of ferrite chip beads in EIA 0201 case size (0.6 x 0.3 x 0.3mm), but with the electrical performance of much larger components.

The devices are now being fabricated in production volume quantities, and sample priced at $0.05 each with a delivery of 2 weeks ARO.