T-Series IGBT Modules Lineup Expansion to 1700V
Mitsubishi Electric Corporation will continue the expansion of its successfully launched T-series power semiconductor modules by introduction and commercialization of its 1.7kV rating line-up
Mitsubishi Electric Corporation will continue the expansion of its successfully launched T-series power semiconductor modules by introduction and commercialization of its 1.7kV rating line-up. The new modules realize improved power density, reliability and cost efficiency for general-purpose and servo inverters, uninterruptible power supplies (UPS), photovoltaic (PV), wind power-generation systems and other industrial equipment.
The most remarkable feature of the novel 7th generation CSTBTTM and diode chip set is the significant reduction of switching losses. As result even at relatively low carrier frequencies below 1 kHz, the new 1700V modules offer an improved total loss behavior when compared to previous 1700V IGBT-generations. This benefit is getting even more evident with increasing PWM switching frequencies typical for industrial inverter applications, for example at 2 or 3 kHz.
The 1700V line-up consists of various rated currents between 75A and 600A and supports both half-bridge and 6in1 topologies. Mitsubishi Electric is housing the new chips with the latest package technology providing a Standard-package type as well as an NX-package type.
The 1700V NX modules offer the newly developed SLC (SoLid Cover)-technology, the same feature as supported on 650V and 1200V versions of this package type. The SLC-technology combines a solder-free resin insulated metal baseplate (IMB) and a specially controlled epoxy resin potting material. Due to the matched thermal expansion coefficients of the constituent materials, thermally induced mechanical stress within the module is significantly reduced and the pump-out effect on the thermal grease due to baseplate warpage during heat cycling is also minimized. This feature makes the NX-module type ideal for inverters operating under challenging conditions with heavy and intermittent load cycles. Also, the use of hard mold potting instead of silicone gel provides a higher resistance against aggressive gases or harsh environmental conditions and offers – due to its property of being silicone free – attractive possibilities in certain applications.
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