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Sun Top Electronics Releases Thick-Film Hybrid ICs


New Products Nov 22, 2004 by Jeff Shepard

Sun Top Electronics Co. Ltd. (Taiwan) released its thick-film hybrid ICs that are suitable for use in cars, meters, home appliances, PCs, industrial equipment and telecom devices. The devices feature ceramic substrate, reduced PCB dimension and high reliability. The products utilize COB or TAB processes. Lead time is four to eight weeks.