Sun Top Electronics Releases Thick-Film Hybrid ICs
New Products
Nov 22, 2004
by Jeff Shepard
Sun Top Electronics Co. Ltd. (Taiwan) released its thick-film hybrid ICs that are suitable for use in cars, meters, home appliances, PCs, industrial equipment and telecom devices. The devices feature ceramic substrate, reduced PCB dimension and high reliability. The products utilize COB or TAB processes. Lead time is four to eight weeks.
