New Industry Products

STMicroelectronics Offers MSOP8/MLP8 Packages

September 19, 2002 by Jeff Shepard

STMicroelectronics Inc. (Geneva, Switzerland) introduced two new tiny packages in its portfolio, the MSOP8 and MLP8, which are targeted for use in consumer, computer, communications and industrial markets.

The MSOP8, also called the TSSOP8 3x3 according to JEDEC standards, provides a 23-percent reduction in size compared to its predecessor, the TSSOP8. The MSOP8 measures 3mm x 3mm x ±0.1mm, and comes in a standard tape-and-reel package. Samples and volume production of the MSOP8 are expected during fourth-quarter 2002.

The MLP8, also called the VFQFPN8 according to JEDEC standards, improves board-space efficiency, and measures 5mm x 3mm. It has the same overall footprint as the standard SO8N package with a 118-percent larger die area and a typical overall thickness of 0.85mm and 1.27mm pitch. Samples and volume production of the MLP8 are planned for fourth-quarter 2002. Pricing will be based on the product involved.