Silego Intros Integrated Load Switches and Thinnest Plastic Package

Silego Technology’s Power Division has introduced its Nanopower load switch family. The Nanopower family launches with two products: the SLG59M1470V supporting up to 6 A loads and the SLG59M1460V supporting up to 2 A loads. Silego’s proprietary sub-micron copper power FET technology supports the world’s smallest full-featured, high efficiency power switches down to 1 x 1 mm in standard plastic packaging. At the same time, Silego revealed the Lo-Z ETDFN (Extreme Thin DFN) package. The Lo-Z package deploys the latest state of art flip chip on lead frame packaging technology that achieves a thinness of 0.27 mm.

Referring Silego’s new line of Nanopower load switches, Jay Li, Director of Marketing commented: “Mobile system designers desire load switches that achieve three parameters at the same time: fast turn on, low Rds(ON), and low power consumption. Existing P-Channel MOSFET solutions achieve decent turn on speed with low power consumption, but suffer high Rds(ON) when the power rail is below 2.5 V”

Nanopower load switches support very fast power rail switching down to 9.5 μs. This fast switch-on characteristic allows any sub-system to be powered quickly while providing power isolation when off. When enabled the SLG59M1470V only consumes 35 nA in active mode. The ultra-low power consumption during sleep mode and low Rds(ON) performance during active mode significantly increases battery life.

“Mobile system designers desire load switches that achieve three parameters at the same time: fast turn on, low Rds(ON), and low power consumption. Existing P-Channel MOSFET solutions achieve decent turn on speed with low power consumption, but suffer high Rds(ON) when the power rail is below 2.5 V,” Mr. Li continued. “Our Nanopower devices are the world’s first integrated load switches that achieve all three key mobile performance parameters. This device is widely adopted on many next generation mobile devices including tablets, notebooks, and smartphones.”

SLG59M1470V is packaged in a 9 pin, 1.5 x 2.0 mm STDFN package. The device can switch power rails down to 1.0 V. The Rds(ON) of the SLG59M1470V is rated at 7.4 mΩ. SLG59M1460V is packaged in an 8 pin, 1.0 x 1.6 mm STDFN package. The device can switch power rails down to 1.0 V. The Rds(ON) of the SLG59M1460V is rated at 21.3 mΩ.

At the same time, Silego revealed the Lo-Z ETDFN (Extreme Thin DFN) package. The Lo-Z package deploys the latest state of art flip chip on lead frame packaging technology that achieves a new record in thinness at only 0.27 mm.

“The 0.27 mm package height allows active semiconductor devices to be placed into extremely height constrained regions of the PCB traditionally reserved for thin passive devices,” said John McDonald, Silego’s VP of Marketing. “This development opens up additional form factor possibilities in handheld mobile devices and wearable consumer electronics.” McDonald continued, “Silego is planning to deploy this package as an option for many Silego product families including our popular GPAK Programmable Mixed-signal Matrix and GCLK 32.768 kHz crystal replacement product families.”

According to Silego, the Lo-Z technology is superior to WLCSP. For example, Lo-Z parts are half the package height as compared to WLCSP packages. Moreover, Lo-Z provides additional protection from ambient light and cracking so often associated with handling WLCSPs. The superior mechanical design allows standard PCB manufacturing flows to handle the Lo-Z device.

Silego’s first product introduced in the Lo-Z package is the SLG59M1493Z GreenFET3 load switch. SLG59M1493Z is an 8 pin single channel load switch with 1.0 x 1.6 x 0.27 mm height. This device supports a linear voltage ramp control with adjustable ramp rate. The device switches power rails from 1.0 V to 5.0 V up to 2.5 A continuous. The Rds(ON) is rated and regulated at 17 mΩ.