New Industry Products

Powerex Intros Mega Power Dual IGBT Power Package

September 20, 2002 by Jeff Shepard

Powerex Inc. (Youngwood, PA) introduced its new Mega Power Dual™, a new, optimized, IGBT power package that offers the benefits of three technologies in one package. The Mega Power Dual features a new carrier-stored, trench-gate, bi-polar transistor (CSTBT) chip; a light punch-through (LPT) process; and a plug cell merged design. Applications include high-power inverters and UPS, motor drive and utility interfaces.

The CSTBT chip provides an improvement in VCE versus Eoff, and a decrease of VCE, for optimizing the total power loss. In addition, the Mega Power Dual was designed with a LPT process for decreasing the current leakage and mitigation of thermal run-away, resulting in a lower cross point for positive temperature co-efficient and an ability to be paralleled without matching. Furthermore, a plug cell merged design improves the short-circuit safe-operating area by controlling the saturation current level and reducing the gate capacitance.

The Mega Power Dual is available in the 900A to 1,400A/1,200V range. Samples of the Mega Power Dual are available from stock to eight weeks.