EEPower

Philips Expands LFPAK Range of Power MOSFETs


New Products Aug 11, 2003 by Jeff Shepard

Royal Philips Electronics (Eindhoven, the Netherlands) announced that it has expanded the range of power MOSFETs offered in its SOT669 loss-free package (LFPAK), which are designed for use in dc/dc converter applications, as well as a number of new applications, including notebook computers, desktops and servers, and high-frequency applications.

The new MOSFETs in LFPAK offer increased performance over the SO8 package while maintaining the same footprint. The LFPAK was designed as a power package, unlike the SO8 package, which was designed for switching. By incorporating the thermal properties of much larger power packages, with a profile 40% thinner at 1.1mm, the new LFPAK MOSFETs offer optimal power performance in a small package. The LFPAK MOSFETs offer inductance levels that are 50% percent lower than that of the SO8, which improve the switching speeds. The LFPAK MOSFETs also allows for more efficient conversion of power from the power source to the application, extending the life of the battery or power source.

The new LFPAK MOSFETs are available now in quantities of 10,000 pieces.