Laird Technologies Releases Enhanced Thermally Conductive PCB Substrate
Laird Technologies, Inc. announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.
The Tlam SS LLD is a versatile, thermally-enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4-based PCBs; a key ability in keeping components cool.
A copper circuit layer and aluminum or copper base plate are bonded together with an LLD dielectric, which is essential to the high-performance of the PCB substrate. The dielectric can fit, and is processed through, standard FR4 print-and-etch operations without various parameter modifications. These dielectrics provide electrical isolation, thermal transfer, and an adhesion layer for the substrate.
"The enhanced Tlam SS LLD substrate improves thermal transference from the heat source to the heat sink through PCBs, reducing the thermal stress placed on the PCB," commented Jeffrey Chuang, Laird Technologies Tlam Product Manager. "These new improvements benefit the LED market by providing a higher performing, lower cost thermal interface that extends operational life to the LED apparatus."
The Tlam SS LLD boards are processed through standard pick-and-place surface mount technology (SMT) and manual wire bond operations. Standard constructions are made with one or two ounce copper and 0.040 (1) or 0.059 (1.5) inch (mm) thick aluminum, grade 5052; 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum, grade 6061; with a copper base available.
