Infineon Introduces Power Modules Optimized for Industrial Applications
Infineon Technologies AG (FSE/NYSE: IFX) introduced a new family of compact IGBT (Insulated Gate Bipolar Transistor) modules that enable power converter system solutions optimized for various industrial drives, as well as for windmills, elevators or auxiliary drives, power supplies and heating systems in trains and tractives. The new PrimePACK™ modules are based on an innovative packaging concept that also utilizes the advantages of Infineon's new generation IGBT4 chips.
The innovative module design â�� in which, for example, the IGBT chips are closer to the baseplate's screw-fastening points resulting in a low thermal resistance between baseplate and heatsink â�� offers such features as the ability to reduce internal stray inductance by approximately 60 percent from that of comparable modules. Reduced stray inductance is important to avoid over-voltage spikes. The special layout significantly improves heat distribution, resulting in a low thermal resistance of the whole system. With +150°C, the maximum operating temperature is considerably higher than the +125°C achieved with previous modules. Infineon was also able to lower the minimum storage temperature from -40°C to -55°C. The new IGBT modules for power converter applications can boost nominal current by approximately 20 percent without changing the blocking voltage or the module size, or can offer the same total power loss in a comparatively smaller module.
Offered in both 1200V and 1700V voltage classes, the PrimePACK modules are available in two module sizes; the 89 mm x 172 mm PrimePACK2 and the 89 mm x 250 mm PrimePACK3. The half-bridge configuration and modular design of the PrimePACK modules make it easy to scale the power of converters by employing different module sizes, or by connecting the modules of a given type in parallel. Both modules are up to 45 percent lighter than comparable modules with the same power, which makes it easier to construct and install power converters.
"With introduction of the PrimePACK modules, Infineon is again setting a new power module standard that is carefully aimed at meeting customer needs," said Martin Hierholzer, Head of Industrial Power at Infineon Technologies. "The innovative module design, which has been optimized for system integration, and the new generation of high-performance IGBT4 chips with TrenchStop®/field stop technology combine to optimize the new family of modules to bring greater efficiency and ruggedness to industrial drive systems of all kinds."
Samples of the 1200 V and 1700 V PrimePACK modules are available now. Volume production is expected to begin in the first quarter of 2007. The modules are RoHS-compliant and meet fire protection requirements in accordance with NFF16-101 and 16-102.