New Industry Products

Fairchild Unveils New Integrated "FET Plus Driver Multi-Chip Module" Optimized to Enable High-Frequency Switching in Computing Core VRM Powe

March 04, 2007 by Jeff Shepard

Fairchild Semiconductor introduced the FDMF8700, the first model in a new suite of highly integrated "FET Plus Driver Multi-chip Modules" for use in high-current synchronous buck applications supporting Intel’s DrMOS Vcore dc-dc converter standard.

The FDMF8700 is a fully integrated power-stage solution offered in a space-saving 8 x 8mm micro-lead frame (MLP) package. By replacing a 12V driver IC and three N-channel MOSFETs, the FDMF8700 is claimed to save 50% board space compared to discrete component solutions. The layout and size of the switches and driver die are optimized to enable higher-frequency operation and are intended for use in desktop and server VR11.x vCore conversion, high-current dc-dc point-of-load converters and small form factor voltage regulator modules. The company also claims that the FDMF8700 enables designers to maximize footprint power density, reduce component part count/BOM cost and shorten time to market.

"The FDMF8700 FET Plus Driver is specifically designed to achieve an optimum application solution by using components that are matched electrically, thermally and mechanically to the input and output characteristics of each element, leading to superior module performance unattainable any other way," said Guy Moxey, Director of Fairchild’s Low Voltage Market Segment. "The FDMF8700 exemplifies Fairchild’s commitment to the computing industry through the development of fully optimized, integrated subsystems delivering higher efficiency, smaller footprint and more functionality, while providing superior performance."

Unlike discrete solutions whose parasitic elements combined with board layout significantly reduce system efficiency, the FDMF8700 module is designed to both thermally and electrically minimize parasitic effects and improve overall system efficiency. In operation, the high-side MOSFET is optimized for fast switching while the low-side device is optimized for low RDS(on). This arrangement is intended to accommodate the low-duty-cycle switching requirements needed to convert the 12V bus to supply the processor core with 1.0 to 1.2V at up to 30A. Fairchild’s MLP 8x8 power package extends the concept of enhanced packaging for dc-dc converter applications. The integrated FDMF8700 module provides an additional efficiency gain of 1.5 to 2% for peak- and steady-power levels compared to discrete solutions using D-Pak packaging.

The FDMF8700 is available in a 56-pin (8 mm x 8 mm) MLP. This lead (Pb)-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect. The units are priced (each, 1000 pcs) at US$ 2.50, and available immediately with a delivery time of 8 weeks ARO.