Fairchild Semiconductor introduced the FDD8424H, a complementary 40V MOSFET that provides Dual DPAK packaging and what is claimed to be industry-leading thermal dissipation to increase system reliability, reduce board space and decrease overall system cost.
Optimized for half- or full-bridge inverter designs, the FDD8424H is well-suited for use in backlighting units (BLU) for LCD TVs, LCD monitors, motor drives and lamp drives. Compared to alternative solutions, the FDD8424H in Dual DPAK provides thermal resistance that is five and 10 times lower than solutions using 8-lead and dual SOIC (SO8) packages, respectively. In addition, the integration of a P-channel high-side MOSFET and an N-channel low-side MOSFET into a single package is said to allow a common drain connection within the device, simplifying board layout and reducing design time.
"Fairchild’s FDD8424H offers display designers the ability to optimize the footprint and the thermal performance of their inverter designs," said Mike Speed, Fairchild’s Marketing Manager for Communications and Consumer Products. "The optimization of RDS(ON) and gate charge (Qg) in a Dual DPAK offers improved switching performance compared to conventional SO8 solutions, resulting in lower heat dissipation and increased efficiency. Also, the FDD8424H provides 12% lower case temperature in backlighting inverters while driving eight CCFL lamps."
The lead (Pb)-free device meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect. The units are priced (each, 1000 pcs) at US$ 0.69, and available now with a delivery time of 6 to 8 weeks.
