CPU Coolers combine Active and Passive Technologies
Phononic today launched the HEX 2.0, the industry's newest high performance CPU cooler, at the 2016 Electronic Entertainment Expo (E3) in Los Angeles. Built on Phononic's proprietary thermoelectric cooling technology, the HEX 2.0 offers superb cooling performance in a compact design that allows users to push their processor up to 140-Watts TDP and beyond.
The innovative design combines a small form factor measuring just 125 x 112 x 95 millimeters, unique styling via a swappable 92-millimeter fan and customizable LED illumination. Users can select cooling profiles, change LED colors and keep up-to-date with the latest firmware through the HEX 2.0 software application dashboard.
"With the HEX 2.0, we have created a new category of CPU cooling by offering an alternative for high performance cooling without going to a much larger heat sink/fan or a water based solution," said Michael Bruno, vice president and general manager of Phononic's Electronics Cooling business unit. "With our thermoelectric technology, Phononic is not only meeting consumer demand, but is disrupting the high-performance CPU cooling market by offering a smaller, quieter and more innovative product."
The HEX 2.0 has an integrated electronic control board and utilizes an active and passive cooling design to deliver high performance cooling only when necessary, minimizing the power and fan noise. The HEX 2.0 requires zero power consumption when the CPU is under low stress, up to a peak power of 35 Watts when the CPU is under stress or in overclocked mode.
"There's been a lack of cooling innovation in our market place for quite some time. It's very exciting to see Phononic doing something about it," said Wallace Santos, CEO of Maingear. "It's not easy to show cooling performance in the same class as a liquid cooler in such a small form factor. We're thrilled to showcase the HEX 2.0 in the SHIFT and X-Cube chassis at E3."
Customers can order the HEX 2.0 immediately for $149.99.
