ChipPAC Inc. (Fremont, CA) announced that it is ready to produce a 10mm x 14mm x 1.2mm, four-chip, stacked package, what it claims is the world's thinnest. The company's previous-generation thin package had a height of 1.4mm. The new package can house four different types of semiconductors, including ASIC and memory chips, in addition to more standard memory stacks.
The new thinner profile is the result of two new technologies introduced by ChipPAC into manufacturing, 200mm wafer thinning to less than 75 microns, and what it calls film-die-attach, which is integrated into the wafer thinning process. The film-die attach technology is available for both 200mm and 300mm wafer thinning technology.
The thin package has a low cost of ownership, and the package cost, driven by the use of only one package substrate for all chips, is about 40% less than the total cost of individually packaging four chips.
