Vishay Intertechnology, Inc. has introduced a new series of 45A to 100A three-phase-bridge power modules in the low-profile MTP PressFit package. Compared to devices incorporating solder contact technology, the VS-40MT160P-P, VS-70MT160P-P, and VS-100MT160P-P dramatically lower production costs and increase reliability for welding machines, UPS, switch mode power supplies, and motor drives.
The solderless PressFit technology of the power modules released today allows for easy one-step PCB mounting to significantly reduce assembly time while simplifying in-field maintenance. Offering direct mounting to heatsinks, the devices' low 17 mm profile maximizes space savings while optimizing electrical layouts for application-specific power supplies.
Providing higher reliability and long-term durability compared with solder contact technology, the power modules' PressFit package offers increased resistance to shock and vibration while eliminating issues such as cold spots, voids, splatter, and cracks. In addition, the devices are not subject to solder fatigue, a common failure mechanism in power modules operating at high temperatures.
Optimized for ac-dc input rectification, the 45A VS-40MT160P-P, 75A VS-70MT160P-P, and 100A VS-100MT160P-P offer 3500Vrms insulation voltage, low forward voltage, and low junction-to-case thermal resistance. Designed and qualified for industrial-level applications, the RoHS-compliant devices are UL-approved, file E78996.
Samples and production quantities of the new power modules are available now, with lead times of eight to 10 weeks for large orders.
