Vincotech has released a new MiniSKiiP® product line. Featuring sixpack topology and able to handle up to 200A, these MiniSKiiP® PACK 2 and MiniSKiiP® PACK 3 modules are available with the new Mitsubishi Electric's latest gen 7 chips.
Vincotech’s 1200V MiniSKiiP® PACK 2 & 3 modules reduce static losses by 20%. Designed for industrial and embedded drive applications, these sixpack modules provide superior EMI behavior and cut overall system costs. With the benefit of this extended power range of up to 200A in the MiniSKiiP® PACK 3 module, it is far more easy for engineers to turn up flexible, scalable inverter designs.
The new MiniSKiiP® modules with SIXPACK topology and extended power range are designed for industrial and embedded drive applications. As a true dual-source provider, the MiniSKiip modules a choice of semiconductors, the standard Trench IGBT4 and now the new Mitsubishi Electric gen 7 chip.
