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Cree Technology Breakthrough Enables 50A Silicon Carbide Power Devices

Cree Technology Breakthrough Enables 50A Silicon Carbide Power Devices

austriamicrosystems Introduces First Lightning Sensor IC Targeting Low Power, Portable Applications

austriamicrosystems Introduces First Lightning Sensor IC Targeting Low Power, Portable Applications

ZMDI Launches Smallest Intelligent Battery Sensor IC for Automotive, Industrial and Medical Markets

ZMDI Launches Smallest Intelligent Battery Sensor IC for Automotive, Industrial and Medical Markets

ON Semiconductor Introduces Integrated Switching Buck Regulators

ON Semiconductor Introduces Integrated Switching Buck Regulators

Peregrine Semiconductor Unveils New Power Management Products

Peregrine Semiconductor Unveils New Power Management Products

Fairchild Announces Generation III XS DrMOS 60A Multi-Chip Module Family

Fairchild Announces Generation III XS DrMOS 60A Multi-Chip Module Family

Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion cSoCs

Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion cSoCs


News Apr 11, 2012 by Jeff Shepard
Allegro MicroSystems Introduces New Single Stage Off-Line LED Driver IC Series

Allegro MicroSystems Introduces New Single Stage Off-Line LED Driver IC Series

Teledyne DALSA Semi Announces Sample & Hold Precision Linear Amplifier IC for High Density MEMS/MOEMS Systems

Teledyne DALSA Semi Announces Sample & Hold Precision Linear Amplifier IC for High Density MEMS/MOEMS Systems

Dialog Semiconductor and TSMC Create Process Platform to Advance BCD Power Management Leadership

Dialog Semiconductor and TSMC Create Process Platform to Advance BCD Power Management Leadership


News Mar 29, 2012 by Jeff Shepard
Allegro MicroSystems Announces New 120kHz Bandwidth, High Voltage, 3.3V Current Sensor IC

Allegro MicroSystems Announces New 120kHz Bandwidth, High Voltage, 3.3V Current Sensor IC

TI Expands Small Quantity semiconductor Packaging Options with Availability of Bare Die

TI Expands Small Quantity semiconductor Packaging Options with Availability of Bare Die


News Mar 28, 2012 by Jeff Shepard
Analog Devices Announces Multi-channel Energy Measurement Chip for Broad Range of Monitoring Applications

Analog Devices Announces Multi-channel Energy Measurement Chip for Broad Range of Monitoring Applications

ON Semiconductor Introduces High Efficiency Wireless Charging ICs

ON Semiconductor Introduces High Efficiency Wireless Charging ICs

NEC Develops Ultra-thin Organic Radical Battery Compatible with IC Cards

NEC Develops Ultra-thin Organic Radical Battery Compatible with IC Cards


News Mar 18, 2012 by Jeff Shepard
Cymbet Launches Uninterruptible Power Supply in a Chip

Cymbet Launches Uninterruptible Power Supply in a Chip

GaN Power Semiconductor Market to Exceed $1 Billion by 2021

GaN Power Semiconductor Market to Exceed $1 Billion by 2021


News Mar 15, 2012 by Jeff Shepard
iWatt Opens IC Design Centers in Beijing & Tianjin

iWatt Opens IC Design Centers in Beijing & Tianjin


News Mar 13, 2012 by Jeff Shepard
IDT Announces First True Single-chip Wireless Power Transmitter and Highest-output-power Single-chip Receiver Solution

IDT Announces First True Single-chip Wireless Power Transmitter and Highest-output-power Single-chip Receiver Solution

FTDI Introduces X-Chip Series of Next Generation USB Interface ICs

FTDI Introduces X-Chip Series of Next Generation USB Interface ICs