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MagnaChip Reports Third Quarter 2011 Financial Results

MagnaChip Reports Third Quarter 2011 Financial Results


News Oct 26, 2011 by Jeff Shepard
IR Offers High-voltage LEDrivIR IC for Non-isolated LED Driver Applications

IR Offers High-voltage LEDrivIR IC for Non-isolated LED Driver Applications

Powerex 6th Generation IGBT with CSTBT Technology  Available in Conventional Packages for Easy Upgrade

Powerex 6th Generation IGBT with CSTBT Technology Available in Conventional Packages for Easy Upgrade

SiC, EVs, HAN and Wi-Fi Featured in Smart Grid Electronics Forum Plenary

SiC, EVs, HAN and Wi-Fi Featured in Smart Grid Electronics Forum Plenary


News Oct 25, 2011 by Jeff Shepard
Freescale Semiconductor Announces Third Quarter 2011 Results

Freescale Semiconductor Announces Third Quarter 2011 Results


News Oct 24, 2011 by Jeff Shepard
Texas Instruments Introduces Boost Charger IC for Nano Power Energy Harvesting

Texas Instruments Introduces Boost Charger IC for Nano Power Energy Harvesting

Fairchild Introduces Smart LED Lamp Driver IC

Fairchild Introduces Smart LED Lamp Driver IC

ON Semiconductor Updates Impact of Thailand Flood

ON Semiconductor Updates Impact of Thailand Flood


News Oct 18, 2011 by Jeff Shepard
IR Introduces Automotive-qualified 600 V Gate Drive IC

IR Introduces Automotive-qualified 600 V Gate Drive IC

New Dual-Output Gate Driver Evaluation Board from SemiSouth for Microsemi and Other Power Modules

New Dual-Output Gate Driver Evaluation Board from SemiSouth for Microsemi and Other Power Modules

Allegro MicroSystems Introduces New Automotive, Low Side MOSFET Pre-Driver IC

Allegro MicroSystems Introduces New Automotive, Low Side MOSFET Pre-Driver IC

IXYS and Clare Introduce New Optically Coupled Driver for Power MOSFETs, IGBTs and Thyristors

IXYS and Clare Introduce New Optically Coupled Driver for Power MOSFETs, IGBTs and Thyristors

Infineon Succeeds in Producing Chips on New 300-Millimeter Thin Wafer Technology for Power Semiconductors

Infineon Succeeds in Producing Chips on New 300-Millimeter Thin Wafer Technology for Power Semiconductors


News Oct 10, 2011 by Jeff Shepard
Cree Announces New Z-Rec Silicon Carbide Schottky Diodes for Solar Micro Inverter Designs

Cree Announces New Z-Rec Silicon Carbide Schottky Diodes for Solar Micro Inverter Designs

ROHM Semi Announces Name Change of Subsidiary OKI Semi to Lapis Semiconductor

ROHM Semi Announces Name Change of Subsidiary OKI Semi to Lapis Semiconductor


News Oct 09, 2011 by Jeff Shepard
RF Micro Devices Announces Formation of Compound Semiconductor Group

RF Micro Devices Announces Formation of Compound Semiconductor Group


News Oct 06, 2011 by Jeff Shepard
austriamicrosystems Extends High-Voltage CMOS Technology Towards Power Grid Applications

austriamicrosystems Extends High-Voltage CMOS Technology Towards Power Grid Applications

Analog Devices Digital Isolator Packaging Meets Safety Requirements in Medical & Industrial Applications

Analog Devices Digital Isolator Packaging Meets Safety Requirements in Medical & Industrial Applications

Hyundai Selects Infineon HybridPACK 1 Power Module for Its Current Hybrid Vehicle Generations

Hyundai Selects Infineon HybridPACK 1 Power Module for Its Current Hybrid Vehicle Generations


News Oct 04, 2011 by Jeff Shepard
Powerex Introduces Low Profile Split Dual Si/SiC Hybrid IGBT Modules Featuring Multiple Circuit Topologies

Powerex Introduces Low Profile Split Dual Si/SiC Hybrid IGBT Modules Featuring Multiple Circuit Topologies