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One-Board Discovery Kit with Three, 8-Pin Microcontrollers

One-Board Discovery Kit with Three, 8-Pin Microcontrollers

International Electron Devices Meeting 2018 Reflections and Review

International Electron Devices Meeting 2018 Reflections and Review

The annual IEDM conference, held December 1-5, 2018 in San Francisco, CA, USA, is sponsored by the IEEE Electron Devices Society. It is the…


tech insights Feb 08, 2019 by Gary Dolny
40Vds GaN FETs in 20-Amp Half-Bridge Development Board

40Vds GaN FETs in 20-Amp Half-Bridge Development Board

95% Efficient 2A and 3A Synchronous Buck Regulators in DFN3x3 Exposed Pad Package

95% Efficient 2A and 3A Synchronous Buck Regulators in DFN3x3 Exposed Pad Package

Directly-Cooled Electric Motor Made from Polymer Materials

Directly-Cooled Electric Motor Made from Polymer Materials


News Feb 07, 2019 by Paul Shepard
0.1µF to 10.0µF 125°C Radial, Multilayer Polymer Film Capacitors

0.1µF to 10.0µF 125°C Radial, Multilayer Polymer Film Capacitors

DOE Funding Launch of Cybersecurity Institute for Energy Efficient Manufacturing

DOE Funding Launch of Cybersecurity Institute for Energy Efficient Manufacturing


News Feb 07, 2019 by Scott McMahan
High Operating Temperature Thermal Sensor Array

High Operating Temperature Thermal Sensor Array

PCIM Europe 2019 Topics and Highlights

PCIM Europe 2019 Topics and Highlights

In less than three months from today, the leading international exhibition and conference for power electronics, intelligent motion, renewable…


new products Feb 07, 2019 by PCIM Europe
3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

UnitedSiC to Showcase Expanded Portfolio and Present at APEC

UnitedSiC to Showcase Expanded Portfolio and Present at APEC

Hardware and Software Development Platform for IoT and Embedded System Design

Hardware and Software Development Platform for IoT and Embedded System Design


News Feb 06, 2019 by Paul Shepard
Small and Highly-Precise SMD RTC Consumes 190nA at 3V

Small and Highly-Precise SMD RTC Consumes 190nA at 3V

IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

The International Workshop on Integrated Power Packaging announces IWIPP 2019, to be held in Toulouse, France, April 24-26, 2019.


new products Feb 06, 2019 by IWIPP
Encapsulant Improves Reliability and Extends Operating Life of Power Semis

Encapsulant Improves Reliability and Extends Operating Life of Power Semis


News Feb 05, 2019 by Paul Shepard
260W, 10.4V DC-DC Converter in a Sixteenth-Brick Footprint for PoE, Datacom, and Telecom

260W, 10.4V DC-DC Converter in a Sixteenth-Brick Footprint for PoE, Datacom, and Telecom

Shielded, AEC-Q200, and 4.7µH to 33µH SMD Inductors with 1.2A to 2.9A Ratings

Shielded, AEC-Q200, and 4.7µH to 33µH SMD Inductors with 1.2A to 2.9A Ratings

2.8Vin to 22Vin, 2A lout, 4-Switch Integrated Buck-Boost Converter with I2C Interface

2.8Vin to 22Vin, 2A lout, 4-Switch Integrated Buck-Boost Converter with I2C Interface

MicroPower Direct Introduces High Performance 3W DC-DC Converter in Miniature SIP Package

MicroPower Direct Introduces High Performance 3W DC-DC Converter in Miniature SIP Package

The ME300RU series, available now from MicroPower Direct, is a series of ultra-miniature, high-performance DC-DC converters. Twenty-one standard…


SiC Power MOSFET Gate Drive Evaluation Platform

SiC Power MOSFET Gate Drive Evaluation Platform